SAE GEIA-STD-0005 is a series of SAE documents for managing Pb-free solder and finish risks in aerospace, defense and high-performance electronics. The name reflects its lineage: GEIA merged with three other industry associations to form TechAmerica in 2009, and TechAmerica sold its standards program to SAE International in July 2013.
Part 1: requirements for developing a Lead-Free Control Plan (LFCP).
Part 2: mitigation of the harmful effects of tin whiskers.
Part 3: performance testing of interconnects containing Pb-free solder and finishes; SAE excludes space-flight hardware.
For Class 3, IPC-D-620A invokes Parts 1 and 2 when lead-free tin is a performance and reliability concern. IPC-D-620A itself applies only when specifically included by contract, approved drawing or purchase order. Clause 4.7.10 makes the User responsible for specifying the LFCP Control Level.
Appendix A is optional even where IPC-D-620A applies, and takes effect only if separately and specifically invoked. Its lead-free entry prohibits use unless documented and controlled through an LFCP, and fixes the level at 2C. Table A1 labels this entry 4.6.10 although the base lead-free clause is 4.7.10; the published cross-reference is inconsistent. IPC-HDBK-620 presents similar wording as guidance. The handbook is not binding unless separately and specifically included by the applicable contract, approved drawing or purchase order; its applicable-documents label does not itself impose Control Level 2C.
Within NASA-STD-8739.6B’s applicability, §6.3.2 requires suppliers of PCB assemblies to conform to Parts 1A and 2A at control level 2C. NASA-STD-8739.6B reaches contractors only where referenced in the applicable contract, grant or agreement. For cable and harness work, §9.2.1 leaves the lead(Pb)-free requirements in IPC/WHMA-A-620C-S §§0.1.5–0.1.6 outside the minimum baseline, although a NASA project may impose them. SAE currently lists Part 1B dated 1 August 2023 and Part 2B dated 2 December 2025; NASA-STD-8739.6B still calls out revision A of each.